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Thermal Conductivity Proceedings

DEStech offers a library of proceedings from  the annual International Thermal Conductivity Conference and International Thermal Expansion Symposium.

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9781605956664

Thermal Conductivity 34/Thermal Expansion 22

Edited by
John McCaffrey and Jason Saienga, TA Instruments-Waters

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Thermal Conductivity 33/Thermal Expansion 21

Edited by
Heng Ban, Ph.D., R.K. Mellon Professor of Energy, Department of Mechanical Engineering and Materials Science, University of Pittsburgh, Pittsburgh, PA

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Thermal Conductivity 31/Thermal Expansion 19

Editors
László Kiss and Lyne St.-Georges, Université of Québec à Chicoutimi, Québec, Canada

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Thermal Conductivity 30/Thermal Expansion 18

Editors
Daniela S. Gaal and Peter S. Gaal

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Thermal Conductivity 27/Thermal Expansion 15

Editors
Hsin Wang, Ph.D. and Wally Porter, Metals and Ceramics Division, Oak Ridge National Laboratory

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Thermal Conductivity 26/Thermal Expansion 14

Editor
Ralph Dinwiddie, Ph.D., Metals and Ceramics Division, Oak Ridge National Laboratory

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DEStech offers a library of proceedings from  the annual International Thermal Conductivity Conference and International Thermal Expansion Symposium.

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China, India, Indonesia, Japan,
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South Korea, and Thailand


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