SEARCH

For orders from:

China, India, Indonesia, Japan,
Malaysia, Singapore,
South Korea, and Thailand


Please contact:
Dipak Kumar Guha
DKG Info Systems
Flat H, 17th Floor, Block 4,
Parkland Villas
1 Tuen on Lane, Tuen Mun
New Territories, Hong Kong
Cell: +8-526-430-1461
e-mail: [email protected]

Thermal Conductivity Proceedings

DEStech offers a library of proceedings from  the annual International Thermal Conductivity Conference and International Thermal Expansion Symposium.

List of Products

Showing all 6 results

Thermal Conductivity 31/Thermal Expansion 19

Editors: László Kiss and Lyne St.-Georges, Université of Québec à Chicoutimi, Québec, Canada

Thermal Conductivity 30/Thermal Expansion 18

Editors: Daniela S. Gaal and Peter S. Gaal

Thermal Conductivity 29/Thermal Expansion 17

Editors: John R. Koenig and Heng Ban

Thermal Conductivity 28/Thermal Expansion 16

Editors: Ralph Dinwiddie, Mary Anne White and David L. McElroy

Thermal Conductivity 27/Thermal Expansion 15

Editors: Hsin Wang, Ph.D. and Wally Porter, Metals and Ceramics Division, Oak Ridge National Laboratory

Thermal Conductivity 26/Thermal Expansion 14

Editor: Ralph Dinwiddie, Ph.D., Metals and Ceramics Division, Oak Ridge National Laboratory

Back To Top

DEStech offers a library of proceedings from  the annual International Thermal Conductivity Conference and International Thermal Expansion Symposium.

Close

Join 55,000+ Professionals. Sign Up Today!

Be the first to know about new books in your field, get special discounts and more!

We send about one email per month and will never spam you. Your information is secure and never shared with third parties.

Thank You For Signing Up
To Receive DEStech Emails!